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                                       Details for article 26 of 80 found articles
 
 
  Electromigration Critical Product to Measure Effect of Underfill Material in Suppressing Bi Segregation in Sn-58Bi Solder
 
 
Title: Electromigration Critical Product to Measure Effect of Underfill Material in Suppressing Bi Segregation in Sn-58Bi Solder
Author: Zhao, Xu
Takaya, Satoshi
Muraoka, Mikio
Appeared in: Journal of electronic materials
Paging: Volume 46 (2017) nr. 8 pages 4999-5006
Year: 2017
Contents:
Publisher: Springer US, New York
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 26 of 80 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands