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Journal description
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Details for article 27 of 81 found articles
| Title: |
Effect of Sn Grain c-Axis on Cu Atomic Motion in Cu Reinforced Composite Solder Joints Under Electromigration |
| Author: |
Wang, Yan Wang, Yishu Ma, Limin Han, Jing Guo, Fu |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 49 () nr. 3 pages 2159-2163 |
| Year: |
2020-01-02 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 27 of 81 found articles
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