|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 12 of 45 found articles
| Title: |
Effect of Bonding Time on Microstructure and Shear Property of Cu/In-50Ag/Cu TLP Solder Joints |
| Author: |
Yang, Li Qiao, Jian Zhang, Yao Cheng Gao, Hui Ming Yang, Yao Xu, Feng |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 49 () nr. 7 pages 4300-4306 |
| Year: |
2020-04-24 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 45 found articles
| << previous | next >> |