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Details for article 17 of 45 found articles
| Title: |
Electromigration Behavior of Low-Silver Sn-0.3Ag-0.7Cu-1.6Bi-0.2In Solder Joints |
| Author: |
Li, Mengyuan Han, Jing Guo, Fu Ma, Limin Wang, Yishu Zhou, Wei |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 49 () nr. 7 pages 4237-4248 |
| Year: |
2020-04-17 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 17 of 45 found articles
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