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Journal description
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Details for article 2 of 45 found articles
| Title: |
Backside Metallization of Ag–Sn–Ag Multilayer Thin Films and Die Attach for Semiconductor Applications |
| Author: |
Choi, Jinseok An, Sung Jin |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 49 () nr. 7 pages 4265-4271 |
| Year: |
2020-04-19 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 45 found articles
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