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Journal description
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Details for article 18 of 70 found articles
| Title: |
Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints |
| Author: |
Yao, Zongxiang Jiang, Shan Yin, Limeng Ling, Diying Zhang, Zhongwen Zhang, Liping |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 49 () nr. 9 pages 5391-5398 |
| Year: |
2020-06-24 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 18 of 70 found articles
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