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Journal description
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Details for article 34 of 70 found articles
| Title: |
Investigation of Various Bumps and Redistribution Lines to Inhibit Protected Silicon Nitride Cracks in High Pattern Density Chip Package |
| Author: |
Ho, Ching-Yuan Cheng, Hsin Chang, Yuan-Chih Lee, Hwa-Teng |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 49 () nr. 9 pages 5613-5621 |
| Year: |
2020-07-11 |
| Contents: | |
| Publisher: |
Springer US, New York |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 34 of 70 found articles
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