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Details for article 57 of 61 found articles
| Title: |
The Effect of Thermal Ageing on Solder/Substrate Interfacial Microstructures During Reflow of Sn–37Pb and Sn–3Ag–0.5Cu |
| Author: |
Satyanarayan, Kumarswamy, M. C. Prabhu, K. N. |
| Appeared in: |
Transactions of the Indian Institute of Metals |
| Paging: | Volume 72 (2019) nr. 6 pages 1545-1549 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Springer India, New Delhi |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 57 of 61 found articles
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