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Journal description
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Details for article 61 of 61 found articles
| Title: |
Wettability, Interfacial Intermetallic Growth and Joint Shear Strength of Eutectic Sn–Cu Solder Reflowed on Bare and Nickel-Coated Copper Substrates |
| Author: |
Sona, Mrunali Tikale, Sanjay Prabhu, Narayan |
| Appeared in: |
Transactions of the Indian Institute of Metals |
| Paging: | Volume 72 (2019) nr. 6 pages 1579-1583 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Springer India, New Delhi |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 61 of 61 found articles
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